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Interface IC - Telecom IC
Manufacturer: Maxim Integrated
Description: IC TDM OVER PACKET 676-BGA
Package: 676-BGA
Quantity Available: Over 66,000 pieces
Best price for DS34S132GN+ (Email: [email protected])
Product Parameters
- Manufacturer Part Number : DS34S132GN+
- Manufacturer : Maxim Integrated
- Description : IC TDM OVER PACKET 676-BGA
- Packaging : Tray
- Series : -
- Part Status : Active
- Switch Circuit : TDM-over-Packet (TDMoP)
- Multiplexer/Demultiplexer Circuit : TDMoP
- Number of Circuits : 1
- On-State Resistance (Max) : -
- Channel-to-Channel Matching (ΔRon) : -
- Voltage - Supply, Single (V+) : 1.8V, 3.3V
- Voltage - Supply, Dual (V±) : 1.8V, 3.3V
- Switch Time (Ton, Toff) (Max) : -
- -3db Bandwidth : -
- Charge Injection : -
- Channel Capacitance (CS(off), CD(off)) : -
- Current - Leakage (IS(off)) (Max) : -
- Crosstalk : Surface Mount
- Operating Temperature : -40°C ~ 85°C
- Package / Case : 676-BGA
- Supplier Device Package : 676-TEPBGA (27x27)
- Category : Telecom IC
- Other Part Number : DS34S132GN+-ND
- Delivery Time : Ship within 1 day.
- Manufacturer Production time : 6-8 weeks
- Weight : 0.001KG
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